BambuLab X1E

3D Printer X1E

Soldering Process Guide

操作指南

1. 工具准备 Tools Preparation

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电烙铁、焊丝、助焊剂(松香)、铜擦洗垫、吸锡器、架子

Soldering iron, solder wire, flux (rosin), copper scrub pad, desoldering pump, clamps.

1

电烙铁、焊丝、助焊剂(松香)、铜擦洗垫、吸锡器、架子

Soldering iron, solder wire, flux (rosin), copper scrub pad, desoldering pump, clamps.

2. 预热 Preheating

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打开电源并预热焊铁到适当的温度(建议约 350°C/662°F)。

Turn on the power and preheat the soldering iron to appropriate temperature (recommended around 350°C/662°F).

2

打开电源并预热焊铁到适当的温度(建议约 350°C/662°F)。

Turn on the power and preheat the soldering iron to appropriate temperature (recommended around 350°C/662°F).

3. 清洁焊接头 Cleaning the Tip

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使用铜擦洗垫去除焊铁头上的氧化层。

Use a copper scrub pad to remove oxidation from the soldering iron tip.

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使用铜擦洗垫去除焊铁头上的氧化层。

Use a copper scrub pad to remove oxidation from the soldering iron tip.

4. 焊接 Soldering Operation

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使用夹子固定组件或将其放置在耐热焊接站上(不要直接放在桌面,橡胶或亚克力表面上)。

SSecure components using clamps or place them on a heat-resistant soldering workstation (never directly on desktops, rubber, or acrylic surfaces).

如果焊锡不能正常附着,可以尝试在焊接处涂抹少许松香(可以使用烙铁头轻点),然后立即恢复焊接。

Soldering iron tip to the joint while feeding an appropriate amount of solder wire. Ensure smooth, shiny joints with good adhesion.

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使用夹子固定组件或将其放置在耐热焊接站上(不要直接放在桌面,橡胶或亚克力表面上)。

SSecure components using clamps or place them on a heat-resistant soldering workstation (never directly on desktops, rubber, or acrylic surfaces).

如果焊锡不能正常附着,可以尝试在焊接处涂抹少许松香(可以使用烙铁头轻点),然后立即恢复焊接。

Soldering iron tip to the joint while feeding an appropriate amount of solder wire. Ensure smooth, shiny joints with good adhesion.

5. 冷却 Cooling

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自然冷却或使用风扇加速冷却。使用后,一定要将烙铁放回其支架上,不要将烙铁放在无人看管的表面上。

Let it cool naturally or use a fan to speed up cooling. After use, always put the soldering iron back on its stand. Never leave it on an unattended surface.

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自然冷却或使用风扇加速冷却。使用后,一定要将烙铁放回其支架上,不要将烙铁放在无人看管的表面上。

Let it cool naturally or use a fan to speed up cooling. After use, always put the soldering iron back on its stand. Never leave it on an unattended surface.

Safety Note

Safety Note

安全提示

Related Tools

相关工具

吸锡器
Desoldering Pump

在拆卸和清除带有焊盘的电子元件时,它可以收集熔化的焊料

It collects molten solder when removing electronic components with solder pads.

首先,向下按压吸锡器的柱塞,直到卡住。

First, press down the plunger of the Desoldering Pump until it clicks into place.

用电烙铁加热焊点直至焊料熔化。

取下电烙铁时,迅速将吸锡器的尖端压在焊点上,并按下吸锡器的按钮。

Second, heat the solder joints with an electric soldering iron until the solder melts.

While removing the iron, quickly press the tip of the Desoldering Pump onto the solder joints and press the button of the solder sucker.